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| TransFeed AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip GENERAL DESCRIPTION AVX has combined the best electrical characteristics of its TransGuard Transient Voltage Suppressors (TVS) and its Feedthru Capacitors into a single chip for state-of-the-art overvoltage circuit protection and EMI reduction over a broad range of frequencies. This unique combination of multilayer ceramic construction in a feedthru configuration gives the circuit designer a single 0805 chip that responds to transient events faster than any TVS device on the market today, and provides significant EMI attenuation when in the off-state. The reduction in parallel inductance, typical of the feedthru chip construction when compared to the construction of standard TVS or ceramic capacitor chips, gives the TransFeed product two very important electrical advantages: (1) faster "turn-on" time. Calculated response times of <200 pSec are not unusual with this device, and measured response times range from 200 - 250 pSec. The TransFeed "turn-on" characteristic is less than half that of an equivalent TransGuard part -- and TransGuards clamp transient voltages faster than any other bipolar TVS solution such as diodes; (2) the second electrical advantage of lower parallel inductance, coupled with optimal series inductance, is the enhanced attenuation characteristics of the TransFeed product. Not only is there significantly greater attenuation at a higher self-resonance frequency, but the roll-off characteristic becomes much flatter, resulting in EMI filtering over a much broader frequency spectrum. Typical applications include filtering/protection on Microcontroller I/O Lines, Interface I/O Lines, Power Line Conditioning and Power Regulation. Schematic Diagram IN OUT Electrical Model IN LS RV LS C RON LP OUT RP TYPICAL APPLICATIONS * Fingerprint ID Circuit * Magnetic Field Circuit * LCD Dashboard Driver Where designers are concerned with both transient voltage protection and EMI attenuation, either due to the electrical performance of their circuits or due to required compliance to specific EMC regulations, the TransFeed product is an ideal choice. HOW TO ORDER V Varistor 2 F Feedthru Capacitor 1 05 Voltage 05 = 5.6VDC 09 = 9.0VDC 14 = 14.0VDC 18 = 18.0VDC A 150 Varistor Clamping Voltage 150 = 18V 200 = 22V 300 = 32V 400 = 42V 500 = 50V Y 2 DC Resistance 1 = 0.150 Ohms 2 = 0.200 Ohms 3 = 0.250 Ohms E D Packaging Code Pcs./Reel D = 1,000 R = 4,000 T = 10,000 P Chip Size 2 = 0805 3 = 0612 No. of Elements Energy Rating X = 0.05J A = 0.1J C = 0.3J Capacitance Tolerance Y = +100/-50% Feedthru Current D = 500 mA E = 750 mA F = 1.0 Amp Termination Finish P = Ni/Sn Alloy (Plated) M = Ni/Sn Pb (Plated) 38 TransFeed AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip TRANSFEED ELECTRICAL SPECIFICATIONS (0805 CHIP SIZE) AVX Part Number V2F105A150Y2E _ _ V2F105C150Y1F _ _ V2F109A200Y2E _ _ V2F109C200Y1F _ _ V2F114A300Y2E _ _ V2F114C300Y1F _ _ V2F118A400Y2E _ _ V2F118C400Y1F _ _ V2F118X500Y3D _ _ V3F418A400Y3G _ _ V3F418C400Y3G _ _ Working Working Breakdown Clamping Maximum Voltage Voltage Voltage Voltage Leakage (DC) (AC) Current 5.6 5.6 9.0 9.0 14.0 14.0 18.0 18.0 18.0 18.0 18.0 4.0 4.0 6.4 6.4 10.0 10.0 13.0 13.0 13.0 13.0 13.0 8.520% 8.520% 12.715% 12.715% 18.512% 18.512% 25.510% 25.510% 25.510% 25.510% 25.510% 18 18 22 22 32 32 42 42 50 42 50 35 35 25 25 15 15 10 10 10 10 10 Transient Energy Rating 0.10 0.30 0.10 0.30 0.10 0.30 0.10 0.30 0.05 0.10 0.05 Peak Current Rating 30 120 30 120 30 120 30 120 20 20 15 Typical Cap 800 2500 575 1800 300 900 200 500 75 150 65 DC Resistance 0.200 0.150 0.200 0.150 0.200 0.150 0.200 0.150 0.250 0.200 0.250 Maximum Feedthru Current 0.75 1.00 0.75 1.00 0.75 1.00 0.75 1.00 0.50 0.30 0.20 Termination Finish Code Packaging Code VW (DC) VW (AC) VB VB Tol VC IL ET IP Cap DCR IFT DC Working Voltage (V) AC Working Voltage (V) Typical Breakdown Voltage (V @ 1mADC) VB Tolerance is from Typical Value Clamping Voltage (V @ 1A 8x20S ) Maximum Leakage Current at the Working Voltage (A) Transient Energy Rating (J, 10x1000S) Peak Current Rating (A, 8x20S) Typical Capacitance (pF) @ 1MHz and 0.5 V DC Resistance (Ohms) Maximum Feedthru Current (A) dB Attenuation vs Frequency 0 18LC -10 18A 14A 9A -10 18C -20 -20 14C -30 5A -40 (dB) 9C -40 5C -50 -50 TransFeed 0.1J 0 TransFeed 0.3J -30 (dB) -60 -60 -70 0.01 0.1 Frequency (GHz) 1 10 -70 0.01 0.1 Frequency (GHz) 1 10 39 TransFeed AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip DIMENSIONS L W T 1.143 Max. (0.045 Max.) mm (inches) BW BL EW X S 0.46 0.10 0.18 + 0.25 -0.08 0.25 0.13 1.02 0.10 0.23 0.05 (0.018 0.004) (0.007 + 0.010 -0.003) (0.010 0.005) (0.040 0.004) (0.009 0.002) L S X 2.01 0.20 1.25 0.20 0805 (0.079 0.008) (0.049 0.008) T BW C L BL W EW RECOMMENDED SOLDER PAD LAYOUT (Typical Dimensions) T 0805 3.45 (0.136) mm (inches) L 1.02 (0.040) P 0.51 (0.020) S 0.76 (0.030) W 1.27 (0.050) C 0.46 (0.018) 4 Pad Layout T P P S INPUT W OUTPUT C L 40 TransFeed Array - V3F4 Series TVS Protection and EMI Attenuation in a 4-Element Array W P A T C B D E D ES BL L A F BW V3F4 DIMENSIONS L 1.60 0.20 (0.063 0.008) mm (inches) W T 1.22 Max. (0.048 Max.) BW 0.41 0.10 (0.016 0.004) BL 0.18 +0.25 -0.08 (0.007 +0.010 -0.003) ES 0.41 0.10 (0.016 0.004) P 0.76 REF (0.030 REF) 3.25 0.15 (0.128 0.006) mm (inches) A 0.60 (0.024) B 1.60 (0.064) C 2.20 (0.088) D 0.35 (0.014) E 0.76 (0.030) F 2.60 (0.104) 41 TransFeed AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip PERFORMANCE CHARACTERISTICS INSERTION LOSS COMPARISON (TransFeed vs TransGuard) 0805 - dB vs Frequency 0 -10 -20 (dB) (dB) -30 -40 -50 V2F105A150Y2E -60 -70 0.01 0.1 Frequency (GHz) 0 -10 -20 (dB) -30 -40 -50 V2F118A400Y2E -60 0.01 0.1 Frequency (GHz) 5.6V, 0.3J 1 10 (dB) 18V, 0.1J VC080518A400 0 -10 -20 -30 -40 -50 -60 -70 0.01 0.1 Frequency (GHz) 0 -10 VC080505C150 -20 (dB) (dB) -30 -40 -50 V2F105C150Y1F -60 -70 0.01 0.1 Frequency (GHz) 18V, 0.3J VC080518C400 -10 -20 (dB) -30 -40 -50 V2F118C400Y1F -60 -70 0.01 0.1 Frequency (GHz) 1 10 1 10 -60 -70 0.01 0.1 Frequency (GHz) -20 -30 -40 -50 V2F114C300Y1F 14V, 0.3J VC080514C300 1 10 V2F118X500Y3D 1 10 -50 V2F114A300Y2E -60 0.01 0.1 Frequency (GHz) 18V, 0.05J VC08LC18A500 1 10 5.6V, 0.1J VC080505A150 0 -10 -20 -30 -40 14V, 0.1J VC080514A300 0 -10 1 10 0 42 TransFeed AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip PERFORMANCE CHARACTERISTICS CURRENT vs TEMPERATURE 0805 - 0.1 Joule 30 Component Temperature (C) 18LC 25 18V 14V Note: Dashed Portions Not Guaranteed 5V 9V 20 0.3 0.5 Current (Amps) 0.75 1 CURRENT vs TEMPERATURE 0805 - 0.3 Joule 30 Component Temperature (C) 18V 25 14V 5V 20 0 0.25 0.5 Current (Amps) 0.75 1 43 TransFeed AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip PERFORMANCE CHARACTERISTICS FEEDTHRU VARISTORS AVX Multilayer Feedthru Varistors (MLVF) are an ideal choice for system designers with transient strike and broadband EMI/RFI concerns. Feedthru Varistors utilize a ZnO varistor material and the electrode pattern of a feedthru capacitor. This combination allows the package advantage of the feedthru and material advantages of the ZnO dielectric to be optimized. ZnO MLV Feedthrus exhibit electrical and physical advantages over standard ZnO MLVs. Among them are: 1. Faster Turn on Time 2. Broadband EMI attenuation 3. Small size (relative to discrete MLV and EMI filter schemes) The electrical model for a ZnO MLV and a ZnO Feedthru MLV are shown below. The key difference in the model for the Feedthru is a transformation in parallel to series inductance. The added series inductance helps lower the injected transient peak current (by 2fL) resulting in an additional benefit of a lower clamping voltage. The lowered parallel inductance decreases the turn on time for the varistor to <250ps. Discrete MLV Model PCB Trace LP To Device Requiring Protection Solder Pad Discrete MLVF Model To Device Requiring Protection Solder Pad C RP LS LS RV RV C RP Ron Solder Pad Ron LP Solder Pad Where: Rv Rp = Voltage Variable resistance (per VI curve) 1012 defined by voltage rating and energy level turn on resistance parallel body inductance Where: Rv Rp C Ron Lp Ls = = = = = = Voltage Variable resistance (per VI curve) Body IR defined by voltage rating and energy level turn on resistance minimized parallel body inductance series body inductance C = Ron = Lp = 44 TransFeed AVX Multilayer Ceramic Transient Voltage Suppressors TVS Protection and EMI Attenuation in a Single Chip PERFORMANCE CHARACTERISTICS APPLICATIONS * EMI Suppression * Broadband I/O Filtering * Vcc Line Conditioning MARKET SEGMENTS * Computers * Automotive * Power Supplies * Multimedia Add-On Cards * Bar Code Scanners * Remote Terminals * Medical Instrumentation * Test Equipment * Transceivers * Cellular Phones / Pagers TYPICAL CIRCUITS REQUIRING TRANSIENT VOLTAGE PROTECTION AND EMI FILTERING The following applications and schematic diagrams show where TransFeed TVS/ EMI filtering devices might be used: * System Board Level Interfaces: (Fig. 1) Digital to RF Analog to Digital Digital to Analog * Voltage Regulation (Fig. 2) * Power Conversion Circuits (Fig. 3) * GaAs FET Protection (Fig. 4) FEATURES * Small Size * Low ESR * Ultra-fast Response Time * Broad S21 Characteristics Fig. 1 - System Interface Fig. 2 - Voltage Regulators REGULATOR + Sensor/Keyboard/ Touchscreen Input DIGITAL BOARD By X Bus RF BOARD Fig. 3 - Power Conversion Circuits/Power Switching Circuits +3.3V MAIN POWER Sensor Input ANALOG BOARD DIGITAL BOARD Display POWER MANAGEMENT +3.3V CHIP +5V +1.8V +12V INTERFACE CARD Keyboard DIGITAL BOARD ANALOG BOARD ASIC Fig. 4 - GaAs FET Protection SPECIFICATION COMPARISON MLVF 0805 5ph <600nh <0.025 100pf to 2.5nf see VI curves >0.25 x 1012 <250ps Ls Lp Ron C Rv Rp PARAMETER typical typical typical typical typical typical N/A <1.5nh <0.1 100pf to 5.5nf see VI curves >1 x 1012 <500ps MLV 0805 INPUT OUTPUT Typical turn on time Typical frequency response A comparison table showing typical element parameters and resulting performance features for MLV and MLVF is shown above. 45 |
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